WINTER

Complete system for wafer production

20 October 2006

Diamond wire

with attached grain, separating technology FAST, innovative cutting wheels for edge rounding as well as cutting wheels with FAVS™ technology: With the new generation of tools and processes optimised to one another, Saint-Gobain Abrasives offers the semiconductor industry solutions for efficiently processing sapphire, silicon and SiC. This enables it to produce innovative products such as blue LEDs or 300 mm wafers with the utmost process safety and the highest quality. This results in perfect surfaces even for extremely thin wafers and despite a shorter processing time at higher feed rates. Expensive reworking which can reduce the quality (e.g. environmentally harmful etching) can largely be dispensed with. New bonding systems also enable the service life of the grinding tools to be doubled.